Project description
The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes. Wafer bonding is a critical process in semiconductor manufacturing, enabling the integration of diverse materials and the creation of complex microsystems. A key phenomenon in this process is the bond wave – the progression of the bonding front across the interface. We are looking for a motivated Master’s student to develop a comprehensive numerical framework to predict bond wave propagation to start as soon as possible. This thesis aims to bridge the gap between traditional analytical models and advanced computational methods, specifically focusing on Finite Element Method (FEM). Be part of change FEM Development: Develop and refine a Finite Element model to simulate the dynamics of the wafer bonding process. Validation: Compare simulation results with existing experimental data to ensure model accuracy and reliability. Interdisciplinary Collaboration: Work closely with the System Packaging and Simulation of Semiconductor Technologies departments to align simulation parameters with physical process constraints.
Funding and compensation
Compensation not specified. See the original posting for amounts, duration and conditions.
Eligibility and application requirements
Review the qualifications, research interests and required documents in the description above. The employer or university's original posting is the source for complete eligibility requirements.
How to apply
Submit your application through Fraunhofer's official application process. Apply early as a closing date has not been specified.
Source and listing information
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