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PhD scholarship in High-Speed Hyperspectral and Super-Resolution Terahertz Imaging - DTU Electro

Technical University of Denmark · Kgs. Lyngby, Denmark

Posted · Deadline:

Overview

A PhD position in Artificial Intelligence, Electrical Engineering, Materials Science, Physics at Technical University of Denmark, based in Kgs. Lyngby, Denmark. Applications close on 30 Nov 2026. The listing states that the position is paid.

Key facts

Opportunity type
PhD position
Organization
Technical University of Denmark
Location
Kgs. Lyngby, Denmark
Field / discipline
Artificial Intelligence, Electrical Engineering, Materials Science, Physics
Application deadline
30 Nov 2026
Funding / compensation
Paid
Duration
See source description
Last source check
No source check recorded

Project description

Are you interested in pushing terahertz (THz) imaging beyond today’s limits in speed, bandwidth, and spatial resolution? At DTU Electro, you will work at the interface of ultrafast THz photonics, nonlinear optical detection, coherent imaging, and machine learning to develop a new generation of high-speed hyperspectral THz imaging technology. The PhD project is part of the DFF-funded INSPIRING project (High-speed hyperspectral and super-resolution terahertz imaging). INSPIRING will combine broadband THz-to-near-infrared upconversion with CMOS-array detection to enable high-speed THz imaging. Your main role will be to establish the imaging platform and develop hyperspectral and machine-learning methods for super-resolution imaging and material identification. You will work in an international, interdisciplinary team at DTU Electro. The project includes a planned 3–6-month research stay in Prof. Xi-Cheng Zhang’s group at the University of Rochester, USA.Responsibilities and qualifications Your research will focus on high-speed coherent THz imaging with machine learning. You will:

  • Develop and operate a broadband coherent THz imaging platform using optical rectification and/or laser-induced plasma THz sources.
  • Implement wide-field imaging based on THz-to-NIR upconversion and CMOS focal-plane-array detection.
  • Acquire and analyze time-domain hyperspectral THz data with a target bandwidth above 10 THz.
  • Apply machine-learning methods, including CNN and autoencoder-type architectures, for super-resolution reconstruction and material identification.
  • Study semiconductors, polymers, multilayer structures, and industrial test samples, and collaborate with project partners in Denmark and abroad.
  • Publish your results in peer-reviewed journals and present them at international conferences.
  • A letter motivating the application (cover letter)
  • Curriculum vitae
  • Grade transcripts and BSc/MSc diploma (in English) including official description of grading scale

Requirements and eligibility

See the source description and original listing for specific eligibility requirements.

Application documents

See the source description and original listing for required application documents.

Funding, benefits and conditions

See the source description and original listing for additional benefits and employment conditions.

Contacts and supervision

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Before you apply

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How to apply

Apply via efzu.fa.em2.oraclecloud.com. Application deadline: 30 Nov 2026. Confirm the current requirements there.

Source and listing information

Application source: efzu.fa.em2.oraclecloud.com. Listing details may change; confirm them on the source site. A source check confirms page availability, not endorsement of the organization.

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Frequently asked questions

What type of opportunity is this and where is it based?
This is a PhD position at Technical University of Denmark, based in Kgs. Lyngby, Denmark.
What is the application deadline?
Application deadline: 30 Nov 2026. Confirm the current deadline on the original listing.
Is funding or compensation specified?
Paid. Check the original listing for exact amounts and conditions.
Where can I apply and check the full requirements?
Use the application link to efzu.fa.em2.oraclecloud.com. The original listing provides the full requirements, documents and application instructions.

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